SONOSYS Ultraschallsysteme GmbH

展位号 2681

www.sonosys.de

SONOSYS®可提供单晶圆与批次工艺上, 频率范围从400千赫至 5兆赫等各种高复杂性超声波/兆声波系统.

关于我们

公司简介 SONOSYS®致力于单晶圆与批次工艺上, 频率范围从400千赫至 5兆赫等各种高复杂性超声波/兆声波系统的开发, 制造和分销. SONOSYS®超声波/兆声波系统提供高效率去除小至纳米级存在于表面易碎的基材如硅晶圆, 平面显示屏, 掩模, 微系统或LIGA-Technique中的特殊部件上的颗粒. 主要市场: • 半导体 • 微米/纳米级技术 • 微机电 • 硬盘 • 光伏 • 光学工业 • 食品工业 • 声化学 • 研究机构 主要应用: • 颗粒去除 • SC1 清洗 • 光刻胶去除 • 湿蚀刻 • CMP后道清洗 • 声化学增强 SONOSYS® 既有产品: • 兆声波槽 • 发振板 • 沉入式发振器 • 面向式发振器 • 单喷头/双喷头 兆声波发振器 • 帘幕式发振器 • 兆声波发振源 • 兆声波雾化器

地址
SONOSYS Ultraschallsysteme GmbH
Daimlerstr. 6
75305 Neuenbürg
Germany

电话: +49 7082 791840
传真: +497082 7918499
网址: www.sonosys.de

联系人

Ralf Emberger
电话: +49-7082 79 184-18
Bowen Tang
电话: +86 133 5005 7712
代表
ASTRONICS TECHNOLOGIES PRIVATE LTD
No 86. 1st Section Renmin Nan Road
610016 Chengdu
P. R. China

电话: +86 28 83352813
网址: www.astronics.sg

展示产品

SONOSYS®超声波/兆声波系统提供高效率去除小至纳米级存在于基材, 半导体硅晶圆, 平面显示屏, 掩模, 微系统及LIGA上的颗粒.

既有产品: 发振板, 浸泡式发振器, 面向式发振器, 单喷头/双喷头 兆声波发振器, 帘幕式发振器,兆声波雾化器, 及小型模块化最高至2000瓦的兆声波发振源

单喷头与双喷头

兆声波单喷头与双喷头 (600千赫~5兆赫可选)可将声波传送至流体及其表面, 藉由最高35瓦的功率输出, 集中于仅4毫米直径的点, 进行非接触式的高效清洗, 双喷头可搭载两种不同频率进行颗粒大小范围较广的颗粒去除.

沉入式发振器
400千赫~ 2兆赫

SONOSYS®沉入式发振器可使用于各种容器与介质并具有最大的使用弹性, 不锈钢本体披覆PVDF抗化性, 可做成4", 6", 8" 晶圆大小的有效面积, 适应不同频率及最高输出功率至2000瓦以满足多种应用及架构.
Single and dual nozzles

The Megasonic single and dual nozzles (600kHz to 5 MHz) transmits the sonic wave into the flowing water and its surface. With up to 35 W concentrated on a small point of only 4 mm results in superb results in contactless cleaning. The dual nozzle works with two distinct frequencies and provides removal of a wider range of particles.

The single and dual nozzles are used in cleaning of single wafers, masks, LCD panels and substrates.


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沉入式发振器

400千赫~ 2兆赫

SONOSYS®沉入式发振器可使用于各种容器与介质并具有最大的使用弹性, 不锈钢本体披覆PVDF抗化性, 可做成4", 6", 8" 晶圆大小的有效面积, 适应不同频率及最高输出功率至2000瓦以满足多种应用及架构.

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新闻和创新

Single and dual nozzles systems for flexible and effective use in surface cleaning

When it comes to small and smallest particles on surfaces, the use of Megasonic is known for years (i.e. ultrasonic waves in the higher frequency range, usually 400kHz upwards). Most notably, if particles smaller 1 micron shall be removed, the method is quite successful. Thereby, it doesn’t damage the sensitive micro- and nanostructures of the substrate, since the cavitation bubbles are much smaller than with traditional ultrasound. Typical applications are wafer cleaning, MEMS and microstructure cleaning and etching, removal of photoresist in photo masks and many others.

The latest trends with this technology look at even higher frequencies, that is more than currently 5 MHz for even smoother cleaning and the control systems become more advanced. With future generations it will be possible to digitally control the nozzles, allowing for a wide control range and very short cycles of on/off times.

Nowadays nozzles are available in a single or dual versions, meaning, that either one frequency – e.g. 1MHz – or a combination of two frequencies – e.g. 1+3 MHz – is applied. The fully metal-free design with a housing made of PTFE (Polytetrafluoroethylene ) allows to meet the high requirements in the semiconductor industry. The medium passes by at the internal piezo ceramic which modulates the high frequency ultrasound into the water stream and is finally focused by a quartz glass nozzle outlet with a width of approx. 4mm, resulting in a Megasonic jet stream to effectively cleaning your surface.

This way, for example a 200mm/8” Si-wafer can be cleaned within 1 minute from silicon nitrite (Si3N4) and silicon dioxide (SiO2) particles, depending on cleaning media and temperature up to a PRE of >= 98%.

Any question? – Reach out to us at info@sonosys.de or bowen.tang@astronics.sg for assistance in mainland China.

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