MUEGGE GmbH

展位号 2680

www.muegge.de

MUEGGE – 独特的等离子体特性 用于蚀刻和沉积: 高密度等离子体, 脉冲等离子体, 纯各向同性等离子体, 无离子轰击.

关于我们

MUEGGE is a leading supplier of scalable plasma technology for Photovoltaic, Flat Panel Display and Semiconductor applications as well as Remote Plasma Source (RPS) applications in the Semiconductor and MEMS markets. MUEGGE has a strong experience in Strip/Removal tools which enable a fast dry etch process for SU-8, KMPR and PMMA. This is a key process technology for Semiconductor and MEMS fabrication. Further examples of MUEGGE`s stripping applications are in the "Semiconductor Backend" area as Stress Relief Etching after Grinding and Recess Etching for the Through Silicon Via Technology (3D integration). In the "Semiconductor Frontend" MUEGGE offers a Remote Plasma Source for isotropic etching of Silicon and Silicon compounds, as well as scalable plasma arrays for plasma enhanced deposition and chamber cleaning.

地址
MUEGGE GmbH
Hochstr. 4 – 6
64385 Reichelsheim
Germany

电话: +49 6164 93070
网址: www.muegge.de

联系人

Oliver Eckstein
代表
Beijing Jenerator Electronic Co.,Ltd
1705-1706, Building 14, No.1 TianXing Street
102488 Beijing , FangShan District
P. R. China

网址: www.muegge-jenerator.com/

展示产品

等离子体组件
半导体技术改变了我们对世界的看法–但等离子体加工使每个人生产产品成为可能。高密度微波辅助等离子体源在蚀刻和沉积系统中表现出卓越的性能,这些系统需要高蚀刻率,而不会对材料造成电荷或损坏

作为等离子体组件制造商,我们的领先地位有助于您开发和调整您的系统–同时确保快速进入市场和低COO。作为我们 “交钥匙 “产品范围的一部分,我们为各种不同的生产工具和应用提供等离子组件:

氧化物和氮化物层的高密度沉积
大面积沉积和蚀刻
SU-8距离
高度选择性地去除有机物质
用于清洗对氧气敏感的材料的非氧化性化学方法(H2工艺)
敏感表面(如传感器)和3D结构的无损清洗
各向同性室清洁
LIGA工艺(光刻、电镀和成型)
远端等离子体源

The RPS is a complete microwave plasma subsystem designed for easy turnkey integration. It offers a reliable solution for fluorine and non-fluorine chemistries covering a wide process range of gases, gas-flow, pressure and power. Delivering a flow of uncharged atomic species (radicals), it is the ideal remote plasma source for a large variety of applications, ranging from fast PR- and polymer-removal to isotropic etching and CVD.

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等离子阵列(大面积)

The plasma array is a low-pressure plasma source, it can be used for plasma-supported surface treatments, such as surface activation, etching or depositions. It is a direct microwave plasma source without use of a magnetic field.
The array system is designed for use on vacuum process chambers.
Typical applications for the array system are:
• Isotropic etching
• Plasma-supported depositions
• Stripping photoresist
• Service cleaning and service conditioning

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解封装设备 & 去胶设备

The MUEGGE STP microwave plasma systems are ideal for photoresist ashing (perfect for SU-8), descum, wafer cleaning, surface activation and silicon and silicon nitride etching.

The MUEGGE STP series has successfully integrated a plasma process and system technology to remove SU-8 with dry plasma etching. Also for removing sacrificial layers, the isotropic etch property of microwave plasma is of advantage to undercut the top layer.

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