FEINMETALL was established 1964 in Germany and has specialized in the field of contact technologies for the automotive, electronics and semiconductor industry.
Booth number: 2784
INNOVAVENT (2003), 20 employees, LINE BEAM Laser Optics for LLO and Annealing applications, 450m2 clean room facility and application lab for feasibility /demo process testing.
Booth number: 2677
Lapmaster Wolters offers a wide range of processing machines for high precision surface finishing.
Booth number: 2671
LPKF develops and produces precision machines and technologies for material processing, originally for the production of circuit board prototypes.
Booth number: 2678
The MCRT is one of today’s leading providers of outstanding contamination control solutions for semi-, micro- and nano-technology.
Booth number: 2575
Osiris International is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor and microsystems (MEMS) technology.
Booth number: 2788
PRECISION SURFACING SOLUTIONS supports manufacturers in a wide variety of industries in which precision grinding, lapping, polishing, deburring.
Booth number: 2671
ProTec® – The Gripper for touchless gripping by electrostatic energy field. Based on electrostatic forces we chuck various kinds of substrates, e.g. glass, foil, silicon.
Booth number: 2676
With more than 1,000 systems sold and comprehensive technological expertise, we have been supporting our customers in the production of highpurity monocrystals.
Booth number: 2680
Raith is a leading precision technology solution provider for nanofabrication, electron beam,focused ion beam,nanoengineering and reverse engineering applications.
Booth number: 2790
Equipment for surface treatment of semiconductor wafers (etching, plating, cleaning, drying) with standardized machines or customized equipment.
Booth number: 2579
SONOSYS® offers highly sophisticated ultrasonic and megasonic cleaning systems for sinlge-wafer and batch processes in the frequency range from 400 kHz to 5 MHz.
Booth number: 2577
We develop fast ramping laboratory ovens and high precision hot plates, reflow solder ovens, high vacuum MEMS sealers and Semiautomatic wire bonders.
Booth number: 2683
Click here if you notice an image that violates copyright or privacy rights.