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German Pavilion at
SEMICON China 2020

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27 – 29 June 2020 – Shanghai, P. R. China

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German Exhibitors

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FEINMETALL GmbH

FEINMETALL was established 1964 in Germany and has specialized in the field of contact technologies for the automotive, electronics and semiconductor industry.

Booth number: 2784

INNOVAVENT GmbH

INNOVAVENT (2003), 20 employees, LINE BEAM Laser Optics for LLO and Annealing applications, 450m2 clean room facility and application lab for feasibility /demo process testing.

Booth number: 2677

Lapmaster Wolters GmbH

Lapmaster Wolters offers a wide range of processing machines for high precision surface finishing.

Booth number: 2671

LPKF Laser & Electronics AG

LPKF develops and produces precision machines and technologies for material processing, originally for the production of circuit board prototypes.

Booth number: 2678

MCRT GmbH

The MCRT is one of today’s leading providers of outstanding contamination control solutions for semi-, micro- and nano-technology.

Booth number: 2575

Osiris International GmbH

Osiris International is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor and microsystems (MEMS) technology.

Booth number: 2788

Precision Surfacing Solutions GmbH & Co. KG

PRECISION SURFACING SOLUTIONS supports manufacturers in a wide variety of industries in which precision grinding, lapping, polishing, deburring.

Booth number: 2671

ProTec Carrier Systems GmbH

ProTec® – The Gripper for touchless gripping by electrostatic energy field. Based on electrostatic forces we chuck various kinds of substrates, e.g. glass, foil, silicon.

Booth number: 2676

PVA Crystal Growing Systems GmbH

With more than 1,000 systems sold and comprehensive technological expertise, we have been supporting our customers in the production of highpurity monocrystals.

Booth number: 2680

Raith GmbH

Raith is a leading precision technology solution provider for nanofabrication, electron beam,focused ion beam,nanoengineering and reverse engineering applications.

Booth number: 2790

RENA Technologies GmbH

Equipment for surface treatment of semiconductor wafers (etching, plating, cleaning, drying) with standardized machines or customized equipment.

Booth number: 2579

SONOSYS Ultraschallsysteme GmbH

SONOSYS® offers highly sophisticated ultrasonic and megasonic cleaning systems for sinlge-wafer and batch processes in the frequency range from 400 kHz to 5 MHz.

Booth number: 2577

UniTemp GmbH

We develop fast ramping laboratory ovens and high precision hot plates, reflow solder ovens, high vacuum MEMS sealers and Semiautomatic wire bonders.

Booth number: 2683

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