AP&S provides batch- and single wafer wet process solutions including manual, semi- and fully automated equipment.
Booth number: 2579
ATT offers a wide range of extremely performant, reliable temperature controlled wafer chuck systems for the semiconductor industry.
Booth number: 2674
Groz-Beckert is the leading supplier of punching equipment for LTCC/MLC technology, precision parts and fine tools for other industrial sectors.
Booth number: 2677
Since its founding in 1967 JULABO has consistently set new Standards for high-Performance and reliable temperature control.
Booth number: 2782
PASS Ltd supply state-of-the-art production equipment for MLCC, MLCI and LTCC manufacturing and electrical ceramic.
Booth number: 2679
PROAUT TECHNOLOGY is specialized in creating solutions for process automation matching customers’ requests. For the Wafer Back End area we have several different standard machines.
Booth number: 2575
ProTec® - The Gripper for touchless gripping by electrostatic energy field. Based on electrostatic forces we chuck various kinds of substrates, e.g. glass, foil, silicon.
Booth number: 2573
Raith offers an intern. service and support structure,the best solutions for EBL, FIB-SEM nanofabrication, IC reverse engineering and life sciences applications.
Booth number: 2685
Equipment for surface treatment of semiconductor wafers (etching, plating, cleaning, drying) with standardized machines or customized equipment.
Booth number: 2675
SPEKTRA equips customers worldwide with high-precision primary+secondary calibration systems. We also develop optimized digital test solutions for major MEMS sensor manufacturers.
Booth number: 2778
Stratus Vision GmbH designs and produces AOI (Automated Optical Inspection) systems and technology since 2003. We also cooperate with Leica for high precision wafer inspection.
Booth number: 2679
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