UniTemp GmbH

www.unitemp.de

We develop fast ramping laboratory ovens and high precision hot plates, reflow solder ovens, high vacuum MEMS sealers and Semiautomatic wire bonders.

About us

The company UniTemp GmbH was founded in August 2000. The corporate of objective is the development, manufacturing, sales and marketing of equipment for microelectronics. 1. In the beginning the UTP series started the successful way of Rapid Thermal Annealing ovens. Meanwhile this kind of oven has been improved and the new RTP and VPO series are well established on a world wide operating market. The key features of these ovens are fast ramp up rates (up to 150 K/sec up to 1200 °C) and its working size (up to 300mm wafer size). 2. Beside these ovens UniTemp is a specialist for reflow solder systems (RSS and VSS series) with a wide variety of options and accessories. 3. Another corporate of objective was the development of a semi automatic wire bonding machine, model WB-300-U.

Address
UniTemp GmbH
Luitpoldstr., 6, c/o UniTemp GmbH
85276 Pfaffenhofen
Germany

Phone: +49 8441 787663
Internet: www.unitemp.de

Representative
Side Semiconductor Technology Limited
Song HuaJiang Road
200093 Shanghai
P. R. China

Phone: +86 21 65342985
Fax: +86 21 653429356
Internet: www.side-semi.com
Alltek Shanghai LLC
256 Pudong South Rd., Huaxia
200120 Shanghai
P. R. China

Phone: +86 21 68864500
Internet: www.alltekusa.com

Products and Services

We offer Rapid Thermal Vacuum process ovens with fast ramp up rates and controlled ramp down rates HVS MEMS sealing Vacuum Process oven and systems. Solder Reflow Systems for fluxless and voidfree solder processes. Table top units for R&D. Wire Bonding machines
Vacuum Solder System with overpressure function

We now offer a Vacuum Solder oven with overpressure function. It allows the either overpressure up to 200mbar or optional up to 2000 mbar.
A significant improvement in the quality of the joining technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering furnace technology in combination with an overpressure module enables cavity-free solder joints.

Further reading

RTP-200 for 8" wafer size

We are the only company offering such a compact 8" RTP system!
This is quite new in our portfolio and closes the gap between the 6" and 12" system.
It accepts a 8" wafer for single processing. We offer a standard unit or a high vacuum option. All kind of features are available.

Further reading

Universal process hood, e.g. for use of pure Hydrogen

This is our new safety cabinet combinable with all our products. It is suited for e.g. vacuum process systems with process gas line for pure Hydrogen. The hood is equipped with a service cart which can be easily rolled out. A gas box and a Hydrogen sensor can be mounted inside the box.

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