We now offer a Vacuum Solder oven with overpressure function. It allows the either overpressure up to 200mbar or optional up to 2000 mbar.
A significant improvement in the quality of the joining technologies is achieved by increasing the reliability of the solder joints and reducing heat dissipation. The soldering furnace technology in combination with an overpressure module enables cavity-free solder joints.
We are the only company offering such a compact 8" RTP system!
This is quite new in our portfolio and closes the gap between the 6" and 12" system.
It accepts a 8" wafer for single processing. We offer a standard unit or a high vacuum option. All kind of features are available.
This is our new safety cabinet combinable with all our products. It is suited for e.g. vacuum process systems with process gas line for pure Hydrogen. The hood is equipped with a service cart which can be easily rolled out. A gas box and a Hydrogen sensor can be mounted inside the box.