RENA Technologies GmbH
Equipment for surface treatment of semiconductor wafers (etching, plating, cleaning, drying) with standardized machines or customized equipment.
About us
RENA – The art of wet processing.
RENA is the worldwide technological leader for wet processing equipment. We provide the most valuable, innovative wet-chemical solutions for our clients to reach the next level of state-of-the-art. We manufacture highest quality flexible and high-throughput equipment in the Semiconductor, MedTech, Glass, Additive Manufacturing and Renewable Energy sectors. We have 7 manufacturing sites, 5 innovation hubs and more than 3.280 machines installed worldwide. We are constantly developing the most efficient process for our clients to achieve perfect surface quality. With more than 130 engineers, 150 global service experts at 20 service locations we work to make RENA machines a long-term success story.
Address
RENA Technologies GmbH
Höhenweg 1
78148 Gütenbach
Germany
Phone: +49 7723 9313-0
Fax: +49 7723 9313-50
Internet: www.rena.com/en
Products and Services
RENA offers a diverse product portfolio in semiconductor and wafering markets:
Immersion automatic and semi-automatic wet benches:
- Evolution and Revolution
Batch Spray:
- SAT and SRD
Single Wafer Tool:
- Inception
Automatic and manual plating tool:
- EPA
- EPM
Fully automated wafering platform 300mm
Advanced processing solutions for parts cleaning:
- Solano
Furthermore RENA offers different service solutions, from spare parts packages and upgrades through to personalized customer training sessions and warranty extensions.
Platingtool EPM 2
Overview of RENA EPM 2 system benefits
Flexibility:
Different substrate sizes
Adjustable wafer thickness
Wide range of materials
Flexible recipe management
High quality plating performance:
Plating materials:
Pure metals: Cu, Au, Ni, In, Sn, Pt
Alloys: SnAg, PbSn, FeNi
Inert or soluble anode
DC or forward/reverse
pulse plating
Edge exclusion: < 3mm
360° Ti contact pin arrays
Fully-automated wet bench Evolution
Features and Benefits:
Full-Auto,Dry-to-Dry operation
100mm up to 300mm wafer sizes
25, 50 and 100 wafer lots
IDX Flexware Control Software
Simultaneous Lots&Recipes
Advanced Process Monitoring
Integrated HMI Touchscreen
SECS/GEM Interface Options
Class 1 mini-environment
Stainless-steel version for Solvent application
Flexible and Upgradeable
Tailored to Customer Specification
Increased Uptime&Throughput
Extended Chemistry&Tank Life
Reduced Chemical & DI Water Usage
Lower Facility Costs
Cleaning System Solano I
Features and benefits
Up to 99 recipes, each with 20 cleaning steps
Variable data input (time, temperature, speed, parameter, etc.)
Hot air dryer with humidity sensor
Fan-unit with adjustable speed for standby and process mode
Unbalanced sensor for automatic shut off
Front side operation
Low cost of ownership
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