RENA Technologies GmbH

Equipment for surface treatment of semiconductor wafers (etching, plating, cleaning, drying) with standardized machines or customized equipment.

About us

RENA – The art of wet processing.

RENA is the worldwide technological leader for wet processing equipment. We provide the most valuable, innovative wet-chemical solutions for our clients to reach the next level of state-of-the-art. We manufacture highest quality flexible and high-throughput equipment in the Semiconductor, MedTech, Glass, Additive Manufacturing and Renewable Energy sectors. We have 7 manufacturing sites, 5 innovation hubs and more than 3.280 machines installed worldwide. We are constantly developing the most efficient process for our clients to achieve perfect surface quality. With more than 130 engineers, 150 global service experts at 20 service locations we work to make RENA machines a long-term success story.

RENA Technologies GmbH
Höhenweg 1
78148 Gütenbach

Phone: +49 7723 9313-0
Fax: +49 7723 9313-50

Contact person

Bernard Winker
Sales Director Semiconductor | Wafering
Phone: +49 7723 9313-0
Raphael Clemens
Sales Manager Semiconductor
Phone: +49 7723 9313-0
Oliver Pohl
Sales Director Semiconductor
Phone: +49 7723 9313-0
Sabrina Pantier
VP Sales & Marketing
Phone: +49 7723 9313-0

Products and Services

RENA offers a diverse product portfolio in semiconductor and wafering markets:

Immersion automatic and semi-automatic wet benches:
- Evolution and Revolution

Batch Spray:
- SAT and SRD

Single Wafer Tool:
- Inception

Automatic and manual plating tool:

Fully automated wafering platform 300mm

Advanced processing solutions for parts cleaning:
- Solano

Furthermore RENA offers different service solutions, from spare parts packages and upgrades through to personalized customer training sessions and warranty extensions.

Platingtool EPM 2

​​​​​​Overview of RENA EPM 2 system benefits

Different substrate sizes
Adjustable wafer thickness
Wide range of materials
Flexible recipe management

High quality plating performance:
Plating materials:
Pure metals: Cu, Au, Ni, In, Sn, Pt
Alloys: SnAg, PbSn, FeNi
Inert or soluble anode
DC or forward/reverse
pulse plating
Edge exclusion: < 3mm
360° Ti contact pin arrays

Further reading

Fully-automated wet bench Evolution

Features and Benefits:
Full-Auto,Dry-to-Dry operation
100mm up to 300mm wafer sizes
25, 50 and 100 wafer lots
IDX Flexware Control Software
Simultaneous Lots&Recipes
Advanced Process Monitoring
Integrated HMI Touchscreen
SECS/GEM Interface Options
Class 1 mini-environment
Stainless-steel version for Solvent application
Flexible and Upgradeable
Tailored to Customer Specification
Increased Uptime&Throughput
Extended Chemistry&Tank Life
Reduced Chemical & DI Water Usage
Lower Facility Costs

Further reading

Cleaning System Solano I

Features and benefits
Up to 99 recipes, each with 20 cleaning steps
Variable data input (time, temperature, speed, parameter, etc.)
Hot air dryer with humidity sensor
Fan-unit with adjustable speed for standby and process mode
Unbalanced sensor for automatic shut off
Front side operation
Low cost of ownership

Further reading

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