Lapmaster Wolters is a leading supplier of high-precision machine tools and systems for high tolerance surface processing of nearly any kind of workpiece.
Our machines are suitable for virtually unlimited applications, from semiconductor, automotive, aerospace, ceramics, plastics, or glass industries.
We support all customers with a unique, comprehensive scope of high-precision processing machines for flat work pieces: Single or double-sided fine-grinding machines, polishing, lapping, honing, and deburring machines
The slicing and cutting equipment division is specialized since decades in the design and manufacturing of equipment for cutting hard and brittle materials. The products are well known for their durability, precision, and low operating costs in day-to-day use.
Lapmaster Wolters serves its customers around the world through worldwide subsidiaries and regional sales and support centers.
Lapmaster Wolters is a member of the Precision Surfacing Solutions Group.
The AC microLine® 2000-P series is a prime wafer double-side polishing machine series that fits 15 wafer/batch of 300 mm wafer
Outstanding features of the AC 2000-P4 are among others:
• Unique LPAC (Lower Platen Adaptive Control) System
• Unique and patented UPAC (Upper Platen Adaptive Control) System
• 3 Gap Sensors
With this, the AC microLine® series is a benchmark in precision, quality, efficiency,
and cost of ownership.
Diamond wire saw for hard and brittle materials
The DW 288 S6 multi-wire saw is designed for slicing hard and brittle materials in various industries.
The DW 288 S6 is based on the widely used DW 288 product family. It has been optimized for 6” workpieces with material loads of up to 650 mm. The workpiece rocking technology, combined with the adaptive feed, ensures the highest wafer quality, maximum throughput, and lowest cost of ownership.