For more than 30 years, MUEGGE has developed, produced and supplied high-quality microwave solutions for complex process requirement. MUEGGE is a leading developer, manufacturer and provider of plasma source solutions, industrial microwave heating systems, components and hardware.
MUEGGE’s product offering includes scaleable plasma sources (200 mm2 -->1000 mm2), Low pressure sources, Remote Plasma Sources (RPS), PFC abatement sources, Deposition sources, Etch/Strip sources, Microwave ECR sources, plasma monitoring, tuning and measurement devices. Typical operating process pressures of 0.3 – 5.0 Torr with typical process gas flow from 500sccm – 10slm. MUEGGE standard products can operate in either CW or pulse power ranges from 300 W to 100 kW, with frequencies of 915, 2450 and 5800 MHz.
MUEGGE plasma source markets include Architectural Glass, Disk Drive, Flat Panel Display, Semiconductor, Photovoltaic, Material Processing and industrial applications.
The RPS is a complete microwave plasma subsystem designed for easy turnkey integration. It offers a reliable solution for fluorine and non-fluorine chemistries covering a wide process range of gases, gas-flow, pressure and power. Delivering a flow of uncharged atomic species (radicals), it is the ideal remote plasma source for a large variety of applications, ranging from fast PR- and polymer-removal to isotropic etching and CVD.
The plasma array is a low-pressure plasma source, it can be used for plasma-supported surface treatments, such as surface activation, etching or depositions. It is a direct microwave plasma source without use of a magnetic field.
The array system is designed for use on vacuum process chambers.
Typical applications for the array system are:
• Isotropic etching
• Plasma-supported depositions
• Stripping photoresist
• Service cleaning and service conditioning
The MUEGGE STP microwave plasma systems are ideal for photoresist ashing (perfect for SU-8), descum, wafer cleaning, surface activation and silicon and silicon nitride etching.
The MUEGGE STP series has successfully integrated a plasma process and system technology to remove SU-8 with dry plasma etching. Also for removing sacrificial layers, the isotropic etch property of microwave plasma is of advantage to undercut the top layer.