Our portfolio includes batch and single wafer equipment including manual, semi-automated and fully automated wet process machines as well as production supporting equipment like cleaners for FOUP, SMIF and boxes, laboratory equipment and chemical management systems. AP&S processing tools cover all common chemical wet processes used in semiconductor production chains, such as cleaning, etching, stripping, plating, developing, metal etching, e-less plating, lift-off and drying. Our equipment handles masks and wafers up to 300mm including different substrate thicknesses and wafer materials like silicium Si, silicium carbid SiC, gallium nitrid GaN, gallium arsenid GaAs, sapphire, glass.
CleanSurF® - the new AP&S cleaner ensures maximum cleanliness in accordance with highest purity standards to secure the process chains in semiconductor manufacturing and ensure maximum productivity.
The Vulcanio wet bench is a fully automated, high-throughput eless UBM metallization tool for wafers up to 300mm. The batch tool was specially developed for under-bump metallization with electroless deposition technology on Al- and Cu-based substrates for metallization with nickel, palladium and gold. Vulcanio processes different wafer thicknesses incl. thin wafers and TAIKO. This wet bench convinces with exceptional deposition uniformity, highest process stability as well as bath longevity.
Innovative materials SiC and GaN are becoming increasingly important in chip production, especially with regard to electric cars. AP&S is responding to this trend by offering wet process development for innovative substrates in the in-house laboratory “Demo Center” at the company's headquarters. This allows customers to completely outsource development projects for new or critical materials and chemicals.