LPKF Laser & Electronics AG

Booth number 2579


LPKF is spearheading the change from traditional to laser-based production methods.

About us

LPKF is a leading supplier of laser-based solutions for the technology industry. Our laser systems are vital in the manufacture of printed circuit boards, microchips, automotive parts, solar panels and many other components.

Our machines allow our customers to manufacture smaller and higher- precision components. At the same time, the functionality of the components can be increased and new design options can be used. This creates products on the cutting edge of technology, both for the industry and for consumers.

Our employees are laser technology experts and know how to integrate lasers as a tool into powerful machines. With that we have considerable influence on progress in a range of high-tech sectors. The outcome is faster, smaller and more energy efficient products and, thus, improvements in mobility, networking, electricity generation and digital entertainment.

LPKF Laser & Electronics AG
Osteriede 7
30827 Garbsen

Phone: +49 5131 7095-0
Fax: +49 5131 7095-90
Internet: www.lpkf.com

Contact person

Vicky Ding
Phone: 13920507070
LPKF (Tianjin) Co., Ltd.
1-B-1207, XinMao Tech Park, No. 15 RongYuan Road 300384 Hi-Tech Industry Area
300384 Tianjin
P. R. China

Phone: +86 2223 7853198
Internet: www.lpkf.cn

Products and Services

Through Glass Via (TGV) Wafer
Embedding Wafer
Spacer Wafer
Capping Wafer
High Definition PicoWell Arrays
Fine Glass Mask
Glass Wafer with Through Vias

High Quality Microholes in Standard Glasses
For the metallization of microholes are different methods available. Whatever metallization process you want to use, we support you with the production of glass wafers and panels with microholes according to your specifications. We can create v-shaped vias as well as hour-glass shaped vias.

Further reading

Glass Spacer Wafer

Bringing Wafer Level Packaging at a new level of quality and precision
Higher accuracy
Free of any surface defects (chipping, microcracks, thermal induced stress)
Steep sidewalls
Odd shapes

Further reading

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