SONOSYS® is specialized in the development, manufacturing and distribution of highly sophisticated Ultrasonic/Megasonic systems for single-wafer and batch processes, in the frequency range from 400 kHz to 5 MHz. SONOSYS® Ultrasonic/Megasonic systems provide highly efficient removal of particles down to the nano range from substrates with fragile surfaces, such as Wafers, Flat Panel Displays, Masks, Micro Systems or special parts within the LIGA-Technique. Our main markets: • Semiconductor • Micro/Nano Technology • MEMS • Hard Disc Drives • Photovoltaics • Optical Industry • Food Industry • Sonochemistry • Research Institutes Our main applications: • Particle Removal • SC1 Cleaning • Resist Removal • Wet Etching • Post CMP Cleaning • Acoustical Chemical Enhancement Available SONOSYS® systems: • Megasonic tanks • Transducer plates • Submersible transducers • Face-to-face transducers • Megasonic single/dual nozzle • Shower nozzles • Megasonic generators • Atomizers
The Megasonic single and dual nozzles (600kHz to 5 MHz) transmits the sonic wave into the flowing water and its surface. With up to 35 W concentrated on a small point of only 4 mm results in superb results in contactless cleaning. The dual nozzle works with two distinct frequencies and provides removal of a wider range of particles.
The single and dual nozzles are used in cleaning of single wafers, masks, LCD panels and substrates.
400 kHz / 600 kHz / 1 MHz / 2 MHz
The SONOSYS® submersible transducers can be used with any vessel and medium and offer maximum flexibility. Made of stainless steel of PVDF in different sizes (4”, 6” or 8”) and with different frequencies (at power up to 2000 W) they fit many applications and set-ups, particularly in experiments and in the lab.
When it comes to small and smallest particles on surfaces, the use of Megasonic is known for years (i.e. ultrasonic waves in the higher frequency range, usually 400kHz upwards). Most notably, if particles smaller 1 micron shall be removed, the method is quite successful. Thereby, it doesn’t damage the sensitive micro- and nanostructures of the substrate, since the cavitation bubbles are much smaller than with traditional ultrasound. Typical applications are wafer cleaning, MEMS and microstructure cleaning and etching, removal of photoresist in photo masks and many others.
The latest trends with this technology look at even higher frequencies, that is more than currently 5 MHz for even smoother cleaning and the control systems become more advanced. With future generations it will be possible to digitally control the nozzles, allowing for a wide control range and very short cycles of on/off times.
Nowadays nozzles are available in a single or dual versions, meaning, that either one frequency – e.g. 1MHz – or a combination of two frequencies – e.g. 1+3 MHz – is applied. The fully metal-free design with a housing made of PTFE (Polytetrafluoroethylene ) allows to meet the high requirements in the semiconductor industry. The medium passes by at the internal piezo ceramic which modulates the high frequency ultrasound into the water stream and is finally focused by a quartz glass nozzle outlet with a width of approx. 4mm, resulting in a Megasonic jet stream to effectively cleaning your surface.
This way, for example a 200mm/8” Si-wafer can be cleaned within 1 minute from silicon nitrite (Si3N4) and silicon dioxide (SiO2) particles, depending on cleaning media and temperature up to a PRE of >= 98%.
Any question? – Reach out to us at firstname.lastname@example.org or email@example.com for assistance in mainland China.