The company UniTemp GmbH was founded in August 2000. The corporate of objective is the development, manufacturing, sales and marketing of equipment for microelectronics. 1. In the beginning the UTP series started the successful way of Rapid Thermal Annealing ovens. Meanwhile this kind of oven has been improved and the new RTP and VPO series are well established on a world wide operating market. The key features of these ovens are fast ramp up rates (up to 150 K/sec up to 1200 °C) and its working size (up to 300mm wafer size). 2. Beside these ovens UniTemp is a specialist for reflow solder systems (RSS, RVS and VSS series) with a wide variety of options and accessories. 3. Another corporate of objective was the development of a semi automatic wire bonding machine, model WB-100. This machine has been sold to more than 90 customers worldwide. The WB-200 is the follower.
Our RTP oven series is a single wafer process development tool for up to 1200°C. Optionally up to vacuum up to 10E-6 hPa. Up to 150 mm wafer size.
The oven is SIMATIC controlled and can be easily used by a touch panel system. This system is like a table top system.
The UniTemp VPO-1000-300 Oven is a compact solution for processing up to 300 mm wafer size and up to 1000 °C (optionally up to 1200 °C). Excellent ramp up and ramp down rates are guaranteed by double crossed IR lamp fields and cooling by gas. A lift pin version and a remote control system is also available as well as the option for connecting a robotics system.
Phone: +49 1522 8978607
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