PASS Ltd was founded in 2007 to serve the markets in Asia, specially the manufacturers of modern electronics, with excellent and state -of-the-art production equipment. Beside the supply of advanced technology, high priority and focus are directed towards
application support, professional mechanical adaptation to automation needs, customer trainning (in China and in Chinese Language) and after sales support.
PASS has built an exclusive portfolio of unique suppliers, becoming a link between the manufacturers of production systems and customers. In China, PASS has its own experts serving the Chinese market in its own language.
Equipment for Manufacturing Electronics on ceramics and wafers. (e.g application for LTCC/HTCC/SOFC/DBC/MLCC/SIC); Puncher
(Mechanical/Laser), Screen-printer, AOI, Stacker, Sintering Furnace, Termination System, Core Driller, Automatic Electrical Tester, Disc Cutter, Polymer Chemical
Inline or Offline AOI systems available: STRATUS NANO inspection: X/Y resolutions 8μm - 0.2μm per pixel for sub micron defects on circuits Substrates up to 12 inch (300mm). STRATUS MICRO inspection: X/Y resolutions 20μm - 1μm per pixel for micron size defects on circuits,Substrates up to 24 inch (600mm).
STRATUS 3D inspection: (Z) Lateral resolutions from 0.5μm, X/Y resolutions 20μm - 1μm per pixel for micron size defects on circuits Substrates up to 10 inch (250mm)
The EKRA semi-/fully automated screen and stencil printer prepared for the Industry 4.0 is the cutting edge tool for printing of a large variety of flexible and rigid substrates for applications from small to high volume applications, R&D as well as prototyping purposes.
Available Special Transport Systems (STS) with a horizontally retractable table allows for quick reconfiguration and manual loading and unloading of the machine.
Puncher KMS Punchers precision, versatility and prepared for Industry 4.0 connections with MES The choice of the design of the punching tool is depending on customers requirements. The KMS tool concept is open for every kind of combinations, such as: - Via Pin diameters down to 50 um - Large punching with single punching units up to 25mm - Punching speed up to 30 hits/sec - Large module tools with 100s of pins
punching - Inline inspection - Inline cleaning, flipping,...
The newest generation of inspection machines not only need to inspect 2D and 3D, but also need to be able to mark the bad parts. This year we have implemented solutions for the detection of critical defects with automatic marking of the bad parts with a laser. The structures in this case can be very small for example 5µm ~ 20µm.
Specialized solutions like this are supplied routinely by our company, therefore if you would like to have an automated solution with AOI, Marking, electrical testing, ... we will be glad to support your requirement.