Innovative solutions for semiconductor production
As a global leader in technology, RENA Technologies GmbH offers integrated production systems for wet chemical surface treatment. This encompasses automatic and manual wet processing systems for producing semiconductor products for all manner of different sectors. These innovative solutions can be used in FEOL and BEOL applications to produce prime wafers, chips, and MEMS, to plate all manner of different substrates, and for reel-to-reel processing.
Wet bench for semiconductor production
RENA’s automatic Batch S wet processing system for wafer and chip production complies with the SEMI standard, meets cleanroom requirements up to ISO class 2, and processes substrates measuring 4" bis 12". Its modular design allows it to be set up and started up in no time at all.
RENA EPM systems for manual electroplating boast an optimum flow of fluid and a tight control of the electrical field. They produce a high level of consistency in plating, achieve high and scalable plating rates, and, thanks to their modular design and low floor space, can be adapted to any working environment.
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