Finetech from Berlin is a manufacturer of innovative sub-micron and high-precision bonders. The manual, semi-automated and full-automatic systems have a modular design for maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield.
Customers include numerous universities as well as companies from industries such as Data- & Telecom, Industrial Semiconductor, Medical, Automotive, Aerospace, Consumer Electronics as well as Academic and Scientific Research. Finetech develops tailor-made equipment solutions according to specific requirements.
With sales & service centers in the US, China, Malaysia and Japan, Finetech provides on-site application support and consultation in global core markets. It is also represented by a worldwide network of representatives.
The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging.
It offers a modular design and can be easily reconfigured for future applications. Typical fields of application include R&D, universities, prototyping and low-volume production.
The system handles a wide range of applications, including laser bar and diode, VCSEL/photo diode bonding and the multi-stage assembly of opto-electromechanical systems (i.e. MEMS/MOEMS).
The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. The system stands for highly stable assembly processes with the focus on maximum yield.
Depending on the requirements, the machine can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production.
General Manager – Finetech Shanghai Co. Ltd.
Phone: +86 21 58661668
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