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UniTemp GmbH

Booth number: 2674

About us

The company UniTemp GmbH was founded in August 2000. The corporate of objective is the development, manufacturing, sales and marketing of equipment for microelectronics.

1. In the beginning the UTP series started the successful way of Rapid Thermal Annealing ovens. Meanwhile this kind of oven has been improved and the new RTP and VPO series are well established on a world wide operating market. The key features of these ovens are fast ramp up rates (up to 150 K/sec up to 1200 °C) and its working size (up to 300mm wafer size).

2. Beside these ovens UniTemp is a specialist for reflow solder systems (RSS series) with a wide variety of options and accessories.

3. Another corporate of objective was the development of a semi automatic wire bonding machine, model WB-100. This machine has been sold to more than 90 customers worldwide. The WB-200 is the follower.

Products and services

We offer

  • Rapid Thermal Vacuum process ovens with fast ramp up rates and controlled ramp down rates 
  • HVS MEMS sealing 
  • Vacuum Process oven and systems 
  • Wire Bonding machines
RTP-100 or RTP-150  Rapid Thermal Vacuum Process Oven

RTP-100 or RTP-150 Rapid Thermal Vacuum Process Oven

Our RTP oven series is a single wafer process
development tool for up to 1200°C. Optionally up to
vacuum up to 10E-6 hPa. Up to 150 mm wafer size.
The oven is SIMATIC controlled and can be easily
used by a touch panel system. This system is like a
table top system.

VPO-1000-300  Vacuum Process oven

VPO-1000-300 Vacuum Process oven

The UniTemp VPO-1000-300 Oven is a compact
solution for processing up to 300 mm wafer size and up
to 1000 °C (optionally up to 1200 °C). Excellent ramp
up and ramp down rates are guaranteed by double
crossed IR lamp fields and cooling by gas. A lift pin
version and a remote control system is also available
as well as the option for connecting a robotics system.

WB-200 Wire Bonder

WB-200 Wire Bonder

The WB-200 is a perfect tool for laboratory use and
small series. It allows an easy tool change from wedge
to ball bonding. For wire from 17-50μ (gold or
aluminium). Key feature is the 3 motorized axis (X, Y
and Z). The Z-axis is mouse controlled. For the options
we offer different solutions depending on the
customers demand and application.


UniTemp GmbH
Luitpoldstr. 6
85276 Pfaffenhofen

Phone: +49 8441 787663

Christopher Curran
Sales Manager
Phone: +49 1522 8978607

Side Semiconductor Technology Limited
Song HuaJiang Road
200093 Shanghai
P. R. China

Phone: +86 21 65342985
Fax: +86 21 653429356

Alltek Shanghai LLC
256 Pudong South Rd., Huaxia
200120 Shanghai
P. R. China

Phone: +86 21 68864500

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Booth number: 2673
ATT Systems GmbH
Booth number: 2770